A*Star’s Institute of Microelectronics and Hitachi Chemical to Develop 3d IC Packaging Material Technologies

Sep.13, 2012 in News

(1888PressRelease) A joint research of high performance material technologies to support thin wafer processing for 3 dimensional integrated circuit (3D IC) packaging.

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A*Star’s Institute of Microelectronics and Hitachi Chemical to Develop 3d IC Packaging Material Technologies

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